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Quantity:
Micro Switch DS040-00C

Features:

  • Small dimensions
  • Mechanical life
  • Good feeling.

Basic Specification Parameter

Electrical Characteristics

Rating

DC12V 100mA

Contact Resistance

≤50m Ω (initial)

Insulation Resistance

≥100M Ω DC500V

Withstand voltage

AC250V 1Minute

Electrical Life

150000 Cycles above

Mechanical Characteristics

Operating force range

100gf ± 30gf

Mechanical Life

150000 Cycles ( no load )

Operating temperature range

-40 °C + 85 °C

Ambient humidity used

≤85%RH

Solder ability

230 °C ± 5 °C 3S

Withstand Soldering temperature

260 °C ± 5 °C 3S

Digree of Protection

GB 4208-93 IP40

Materianls

Part Name

Material

Quality

Remark

Butto n

PA+30%GF

1

Black

Spring

C2680R

1

Silver Plating

Contact

Silver alloy

3

 
Change Plate

C5210R

1

Silver Plating

Base

PA+30%GF

1

Black

Terminal

C2680R

1

Silver Plating

Cover

PA+30%GF

1

Black

Fixed Rod

C2680R

1

 

Soldering Process

Hand soldering :
Use a soldering iron of 30 watts, Controlled at 380 °C approximately 3 seconds while solder applying.
Wave soldering:
When applying wave soldering, the peak temperature of the wave oven should be set to 260 °C max. Condition for soldering (wave & Non-washable Type) Temperature Profile

Tems

Conditions

Preheating temperature

Ambient temperature of the soldered surface of PC board.100 °C max.

Preheating time

60s max.

Peak temperature

260°C max

Continuous dipping time

5 sec max

Number of soldering

2 time max

Reflow soldering:

When applying reflow soldering, the peak temperature of the reflow Oven should be set to 250 °C max . Condition for soldering (Reflow & Non-washable Type) Temperature Profile:

Conditions

A

Temp. rise gradient 1 - 5°C/sec

B

Heating time 60 - 120sec
Heating temperature 120 - 220°C

C

Temp. rise gradient 1 - 5°C/sec

D

Time over 230°C 90sec

E

Peak temperature 260°C
Peak-temp. hold time Momentary
Soldering 1 times

Note: Temperatures and time for A through E in the table above shall be measured on the top surface of the component.

Dimension & Drawing